産品展示
- 層數:12層
Number of layers: 12 layers
闆厚:3.6mm
Thickness:3.6mm
最小孔徑:0.6mm
Min. Hole:0.6mm
材料:RO4350
Base Material:RO4350
技術特點:高頻、高可靠性、壓接孔、背鑽
Technical Feature:High frequency,high reliability,press fit, backdrill
- 層數:4層
Numberoflayers:4layers
闆厚:35mm
Thickness: 3.5mm
最小孔徑:0.6mm
Min.hole:0.6mm
材料:RT5880
Base material: RT5880
技術特點:混壓、階梯槽、埋孔
Technical Feature: Mix lamination,step slot, buried hole
- 層數:4層
Numberoflayers:4layers
闆厚:18mm
Thickness:1.8mm
最小孔徑:1.0mm
Min. hole: 1.0mm
材料:RO4534
Base material:RO4534
技術特點:FR-4與陶瓷基闆混壓
Technical Feature: Mix lamination of FR-4 and ceramic material
- 層數:4層
Numberof layers:4layers
闆厚:16mm
Thickness:1.6mm
最小孔徑:06mm
Min.hole:0.6mm
材料:TLC-32+FR-28
Base material:TLC-32+FR-28
技術特點:高頻、高可靠性
Technical Feature:High frequency，highreliability
- 層數:4層
Number of layers:4layers
闆厚:20mm
Thickness:2.0mm
最小孔徑:0.6mm
Min.hole:0.6mm
材料:聚酰亞胺(P|)
Basematerial:Polyimide(Pi)
技術特點:材料耐高溫、耐輻射
Technical Feature: Heat-resistant,radiation resistant
- 層數:4層
Number of layers: 4layers
闆厚:16m
Thickness:1.6mm
最小孔徑:0.4mm
Min.hole:0.4mm
材料:FR-4+RO4350
Base material:FR-4+RO4350
技術特點:FR-4與陶瓷基闆混壓
Technical Feature: Mix lamination of FR-4 and ceramic material
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